Metalized Ceramic
ECI’s thick film metalized substrates are customized to meet your device footprint requirements. Thick film metallized thru-hole and wraparound castellations provide for leadless surface mountable configurations. Applications include microwave, optoelectronic and power packages. Metallization options include Ag, Mo/Mn and W. Specialized plating processes include Au, Ni, Au/Sn, Cu, Ag and Sn.
Materials
AL203
AIN
BeO
Thick Film Metallization
Molybdenum Manganese
Tungsten
Processes
Single Layer
Wrap Arounds
.010" Lines and Spaces
Thru Hole Metallization
