Power Solutions
ECI offers a wide range of ceramic to metal sealed power packages and substrates to meet your low thermal resistance and critical thermal dissipation applications. Ceramic packaging is available in surface mount designs as well as drop in and bolt-down versions. ECI offers a wide variety of advanced thermal material flanges to provide customers with solutions for high power density applications. The offering includes RF, Power Transistors and solutions for high power densities, high current and high voltage applications.
Ceramic
AIN
BeO
DBC
Metallization
DBC
Mo/Mn
W
Metals
Cu
Cu/Mo
Cu/W
Mo
Braze
Ag
Cu/Ag
Cu/Ag/In
